questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. ds612a rev date: 5-14 TSON8-FL process highlights ? bare copper leadframe with no plating ? die attach: 55 um thin die pick up capability ? interconnect: cu clips technology for better electrical and thermal performance. also available on al strap + wire option. ? plating: 100% matte sn ? marking: pen type laser standard materials ? leadframe: bare copper ? die attach: solder paste* ? interconnect: 2 option, C dual cu clips C al strap + wire 2 mil cu ? mold compound: halogen free *apply to option dual cu clips. reliability qualifcation amkor devices are assembled with proven reliable semiconductor materials. ? all test include pre-condition of: ta = 85c/rh = 85%, 72 hrs with ir refow ta = 265c, 2x ? high temperature storage, ta = 150c, 1000 hrs ? pressure cooker, ta = 121c/rh = 100%/p = 2 atm, 96 hrs ? temperature cycle, -65~150c, 300 cycles test service amkor offers full turnkey business for all power discrete products. we have the capability to test various type of power devices including mosfets, bipolar transistors, igbts, diodes, regulator ics/intelligent power devices, etc. ? amkor power discrete test capability: C static test (dc) C dynamic test (ac, switching/trr, capacitance/rg) C destruction test (inductive load/vsus, i latch, surge, isolation/vil) C thermal resistance (vds, mv, etc.) ? program generation/conversion ? failure analysis ? available test/handling technology ? integrated marking, vision inspection and tape & reel services introduction TSON8-FL (flat lead) is a smaller package (3.3 x 3.3 mm) with thermally enhanced that gives a 64% reduction in footprint area compared with standard soic 8 ld package, yet an equivalent maximum permissible power dissipation capability. this package may also be know as: ? tson-adv ? powerflat ? 3.3 x 3.3 ? tsdson ? minihvson ? powerpak ? 1212-8 ? jedec: mo240 ba application TSON8-FL is suitable for medium-power applications, designed for low on-resistance and high-speed-switching mosfets: ? battery protection circuits ? notebook pcs ? portable electronic devices ? dc-dc converters features ? small and thermally enhanced package with the same power dissipation but 64% less footprint area than soic 8 ld ? dual cu clip interconnect for better heat dissipation effciency ? al strap + wire option is also available ? turnkey with test and packing services ? green materials: pb-free plating & halogen free mold compound new developments ? dual exposed pad for better thermal performance ? thin wafer dicing with narrow saw streets ? larger/higher density leadframe strips ? environmentally friendly pb-free solder paste power discrete data sheet
questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. ds612a rev date: 5-14 cross-section C option 1: al strap + wire cross-section C option 2: dual cu clip shipping ? tape and reel packing C 3000 pcs or 5000 pcs per reel C tape width 12 mm C reel = 330 mm ? barcode packing label ? drop ship TSON8-FL package outline drawing TSON8-FL power discrete data sheet with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and without notice. the amkor name and logo are registered trademarks of amkor technology, inc. all other trademarks mentioned are property of their respective companies. ? 2014, amkor technology incorporated. all rights reserved.
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